Copper pyrophosphate|Cu2P2O7.4H2O|10102-90-6

As manufacturer and supplier of phosphoric acids, phosphats and polyphosphates, we can supply high quality copper pyrophosphate (Cu2P2O7.4H2O) which is used in copper plating applications.

Title: Copper pyrophosphate

Synonyms: Copper pyrophosphate tetrahydrate
Formula: Cu2P2O7.4H2O, Molecular: 373.11
CAS #: 10102-90-6, EC #: 233-279-4

Standard(s): HG/T 3593-1999, Q/2794-2008

Grade: Technical grade, High purity

Specifications	Technical grade	High purity
Packing:	25Kgs/bag, in woven kraft paper bags with inner bag , or as customer's requirements.
Appearance	Light blue granual or powder	Light blue granual or powder
Assay(Cu₂P₂O₇.4H₂O) %	99min	99.9min
Copper (Cu) %	33.3min	34min
Iron (Fe) %	0.008max	0.005max
As %	0.0005max	0.0003max
Pb %	0.001max	0.0005max
Heavy metal (as Pb) %	0.005max	0.001max
Sulphate (SO₄) %	0.5max	0.5max
Insoluble in acid %	0.1max	0.05max

Copper Pyrophosphate are light blue powder, soluble in acid, insoluble in water. Copper pyrophosphate can be soluble in potassium pyrophosphate solution and form complex pyrophosphate solution.

Copper Pyrophosphate is widely used in copper plating industry for decorative protective copper layer and anti-carburization carburization coating.
Due to its high purity, unique crystal structure, and extremely low Fe, Ph, As contents, our copper pyrophosphate is much easier to be chelated by potassium pyrophosphate. Plating solution has excellent polarizing ability and current distribution ability. Fresh plating solution does not need to go through electrolysis procedure and can be directly used for electroplating. Our copper pyrophosphatet has some advantages: plating ratio is fast, plating layer is smooth, and there is no cavity crystal structure, the plating solution is stable with simple maintenance.

Keep in cool dry place.

Air transportation: arranged as ordinary goods.

Harzards Identification & Classifications: N/A

12 months.